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Abstract

The present invention relates to technologies for integrated circuits and Large Area Integrated Circuits (LAICs), which are integrated circuits made from photo-repetition of one or several reticle image fields, stitched together on at least one lithographic process layer. It also relates to a specific class of LAIC that can connect to the contacts of other ICs placed on its surface, where specific contact detection algorithms means are disclosed. The innovations include means for defect tolerance of serial communication links, means for efficient diagnosis of short and stuck-at faults in regular reconfigurable network, means for a programmable interposer for rapid prototyping of 3D stacked chips, means to build efficient large area micro-system devices (LAMS), with distributed and configurable hierarchical structures for power supply, thermal regulation and signal propagation, means to reduce mechanical/thermal/thermo-mechanical issues in LAMS devices, means to propagate analog signal on a configurable digital network, means to predict thermo-mechanical stress peaks.

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First Claim