METHOD OF FORMING INTERFERENCE FILM ON SURFACE OF ALUMINUM ALLOY SUBSTRATE
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United States of America Patent
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Issued Date -
Nov 14, 2013
app pub date -
May 12, 2012
filing date -
May 12, 2012
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Abandoned
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Abstract
A method of forming an interference film on an aluminum alloy substrate includes the following steps: providing an aluminum alloy substrate; cleaning the aluminum alloy substrate through a pre-treatment process; performing an anodic treatment on the aluminum alloy substrate for a predetermined amount of time till an oxidized film having a plurality of cellular tubes is formed on the surface thereof; expanding the holes of the oxidized membrane of the aluminum alloy substrate with an acidic solution to enlarge the diameter of the cellular tubes; enlarging the bottom of the cellular tubes to form a deposition area through an electrical enlarging process; depositing a metal material on the deposition area of the cellular tubes to form an interference structure; sealing the cellular tubes with a sealing agent; and removing dirt. Furthermore, an interference film structure is formed on the aluminum alloy substrate using the aforementioned method.
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