Method for lower thermal budget multiple cures in semiconductor packaging
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United States of America Patent
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Nov 29, 2016
Grant Date -
Nov 14, 2013
app pub date -
May 11, 2012
filing date -
May 11, 2012
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Abstract
A method for forming a multilayer structure comprises the steps of: depositing a first polymerizable layer on a substrate; applying microwave energy to the polymerizable layer while monitoring at least one property of the layer; and, ending the application of microwave energy when the monitored property indicates that the polymerizable layer has reached a desired degree of cure. The property monitored may be optical, e.g., Raman spectrum, or electrical, e.g., dielectric loss. This process control strategy lowers the overall thermal budget, and is especially suitable for curing polymer films on silicon. The method may be used repetitively to cure multiple layers of polymeric material when a thicker film is needed.
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