POLISHING COMPOSITION, POLISHING METHOD USING SAME, AND SUBSTRATE PRODUCTION METHOD
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United States of America Patent
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Issued Date -
Nov 14, 2013
app pub date -
Jan 18, 2012
filing date -
Jan 26, 2011
priority date (Note) -
Abandoned
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Abstract
Provided is a polishing composition characterized by: including at least one of either organic acid or organic salt and including a composition (A) including hydroxyethyl cellulose, ammonia, abrasive grains, and water. The electrical conductivity of the polishing composition is 1.2 to 8 times the electrical conductivity of the composition (A). The polishing composition is mainly used in substrate surface polishing applications.
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