PLASMA PROCESSING DEVICE

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United States of America Patent

APP PUB NO 20130305985A1
SERIAL NO

13981836

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a plasma processing device (S1) configured to perform surface reforming on a workpiece (X) made of a metal material in a vacuum furnace (1) by plasma includes movable power feeding devices (14 and 15) that are movable in the vacuum furnace (1).

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Patent Owner(s)

Patent OwnerAddress
IHI CORPORATION1-1 TOYOSU 3-CHOME KOTO-KU TOKYO 1358710 JAPAN
IHI MACHINERY AND FURNACE CO LTD3-3 TOYOSU 3-CHOME KOTO-KU TOKYO 135-6009

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katsumata, Kazuhiko Tokyo, JP 46 141

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