APPARATUS AND METHOD FOR CONNECTING SENSING LEADS TO LARGE CABLES
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United States of America Patent
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Issued Date -
Nov 28, 2013
app pub date -
May 24, 2012
filing date -
May 24, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A splice enclosure is made from a non-conductive material. The splice enclosure has an arcuate groove configured to accept a cable, a first hole configured to hold a conductive piercing device therein, and a second hole configured to accept a thin lead having a stripped end. The stripped end of the thin lead can be compressively held over the conductive piercing device to create an electrical contact between the cable and the thin lead.
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