Method For Fabricating Conductive Structures of Substrate
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United States of America Patent
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Issued Date -
Nov 28, 2013
app pub date -
Aug 1, 2012
filing date -
May 24, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for fabricating a conductive structure of a substrate includes the steps of: providing an insulating substrate having opposite first and second surfaces and forming an insulating adhesive film on the second surface of the insulating substrate; forming at least a through hole penetrating the insulating substrate and the insulating adhesive film and forming a conductive foil on the insulating adhesive film so as to cover the through hole; and forming a shielding material on the conductive foil and the second surface of the insulating substrate and performing an electrochemical deposition process through the conductive foil so as to fill the through hole with a conductive material along a direction towards the first surface of the insulating substrate, thereby preventing the formation of voids in the through hole and hence reducing the overall resistance and preventing a blister effect from occurring.
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