WIRING BOARD AND MOUNTING STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Nov 28, 2013
app pub date -
May 13, 2013
filing date -
May 24, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wiring board includes an insulating layer; a connection part provided on a surface of the insulating layer, the connection part including a first plating layer including a flat surface and a curved surface continuous with the flat surface, wherein the flat surface and the curved surface are exposed on the insulating layer, and an end portion of the curved surface is in contact with the surface of the insulating layer; and a second plating layer formed on an interior surface of the first plating layer so as to be coated with the first plating layer; and a via formed in the insulating layer so as to be connected to the second plating layer.
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