USE OF CALCIUM HYPOPHOSPHITE AS A FILLER TO INCREASE MECHANICAL PROPERTIES OF A POLYAMIDE COMPOSITION

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United States of America Patent

APP PUB NO 20130317158A1
SERIAL NO

13984897

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Abstract

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The use of a heat stabilized calcium hypophosphite as a filler to increase the mechanical properties of a polyamide composition is described. The composition can also involve reinforcing and/or bulking filler and/or impact modifier agents. Using such a filler one can obtain a polyamide composition having very good mechanical performance with the calcium hypophosphite having a low degree of phoshpine generation.

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Patent Owner(s)

Patent OwnerAddress
SOLVAY (CHINA) CO LTDXINZHUANG INDUSTRIAL ZONE SHANGHAI 201108

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
De, Campo Floryan Shanghai, CN 26 52
Li, Junli Shanghai, CN 46 593
Murillo, Annelyse Shanghai, CN 5 10
Zhang, Tingting Shanghai, CN 71 192

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