SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
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United States of America Patent
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Issued Date -
Dec 5, 2013
app pub date -
May 31, 2013
filing date -
May 31, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Provided is a substrate treating apparatus. The substrate treating apparatus includes a container providing a space in which a supercritical fluid flows or is received, a recovery tube having one end connected to the container to discharge the supercritical fluid within the container, the recovery tube including a valve, and a waste tube connected to the container to discharge the supercritical fluid within the container, the waste tube including a safety valve. The recovery tube having the other end connected to a recovery container in which the supercritical fluid discharged from the container is received for reusing.
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