SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 5, 2013
app pub date -
Jun 4, 2012
filing date -
Jun 4, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor device includes a substrate, a conductive material, and a material layer. The substrate includes a through hole. The conductive material fills the through hole. The material layer is formed in the conductive material, wherein an electrical resistance of the conductive material is lower than an electrical resistance of the material layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully