PACKAGED SEMICONDUCTOR DEVICE WITH AN EXPOSED METAL TOP SURFACE
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United States of America Patent
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Issued Date -
Dec 12, 2013
app pub date -
Jun 4, 2013
filing date -
Jun 6, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In a manufacturing technique for packaged semiconductor devices, a pre-form of a packaged semiconductor device is formed by a molding process which encapsulates the semiconductor device and its associated heat transfer component in a passivating material presenting a surface. The surface is then processed to at least remove excess passivating material and expose the heat transfer component. The processing may further remove a portion of the heat transfer component. The removal process may, for example, utilize a grinding and/or polishing process. The process may be controlled so as to expose or form a heat transfer surface of desired shape and size.
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