COPPER ALLOY AND PROCESS FOR PRODUCING COPPER ALLOY
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United States of America Patent
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Issued Date -
Dec 19, 2013
app pub date -
Dec 13, 2011
filing date -
Dec 13, 2010
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Abandoned
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Abstract
To provide a copper alloy of the FCC structure containing Ni: 3.0 to 29.5 mass %, Al: 0.5 to 7.0 mass %, and Si: 0.1 to 1.5 mass %, with the remainder consisting of Cu and incidental impurities, wherein the copper alloy is of the high strength, but is excellent in workability, and has high electrical conductivity, and can control property thereof, by precipitating a γ′ phase of the L12 structure including Si at an average particle diameter of 100 nm or less in a parent phase of the copper alloy.
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