METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTOR COMPONENTS
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United States of America Patent
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Issued Date -
Dec 19, 2013
app pub date -
Dec 15, 2011
filing date -
Dec 30, 2010
priority date (Note) -
Abandoned
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Abstract
A method for producing a plurality of radiation-emitting semiconductor components (10) is specified, said components each comprising at least one semiconductor chip (1) and a converter lamina (2). For this purpose, this method involves providing a plurality of semiconductor chips (1) in the wafer assembly (10a), said semiconductor chips each being suitable for emitting a primary radiation. Moreover, a plurality of converter laminae (2) are provided on a common carrier (2a), said converter laminae each being suitable for converting the primary radiation into a secondary radiation, wherein a converter lamina (2) is in each case mounted on one semiconductor chip (1) or onto a plurality of semiconductor chips (1) by means of an automated method.
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