METHOD FOR MANUFACTURING A CHIP RESISTOR
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United States of America Patent
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Issued Date -
Dec 26, 2013
app pub date -
Mar 4, 2013
filing date -
Jun 25, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In a method of manufacturing a chip resistor, a semi-product is formed by sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer. Resistor sections arranged in an array on the semi-product are formed by forming longitudinal first slots and transverse second slots through the semi-product. Slits are formed on a first layer of each resistor section to form a resistor main body. A dividing slot is formed on a second layer of each resistor section. Two electrodes are formed to be electrically connected to opposite ends of the resistor main body. The resistor sections are trimmed from the semi-product to obtain the chip resistors.
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