SEMICONDUCTOR PACKAGE STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Dec 26, 2013
app pub date -
Jun 25, 2012
filing date -
Jun 25, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor package structure includes a package substrate having a first surface, a second surface opposite to the first surface, and a sidewall surface between the first surface and the second surface. A semiconductor device is mounted on the first surface. A mold cap encapsulates the semiconductor device. The mold cap includes a vertical extension portion covering the sidewall surface and a horizontal extension portion covering a periphery of a solder ball implanting region on the second surface.
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