Heat Resistant Adhesive Tape
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United States of America Patent
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Issued Date -
Dec 26, 2013
app pub date -
Jun 20, 2013
filing date -
Jun 21, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The aim is to achieve enhanced, and more particularly more stable, adhesive bonds or seals of substrates having different characteristics under thermal load. This aim is accomplished by provision of an adhesive tape having a thickness of at least 150 μm, and exhibiting after storage at 120-150° C. over 60 to 210 days an extendability in machine direction of at least three times its original extent.
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