CONDITIONER FOR SOFT PAD AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Dec 26, 2013
app pub date -
Mar 7, 2012
filing date -
Mar 7, 2011
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Abandoned
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Abstract
The present invention relates to a conditioner for a chemical-mechanical planarization (CMP) pad, which is used in a CMP process that is part of a semiconductor element manufacturing process, and more particularly, to a conditioner for a soft pad, and a method of manufacturing the same, wherein the conditioner can be used under CMP conditions using a slurry having a small amount of polishing particles, and/or a porous pad having comparatively low hardness and very high porosity.
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