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Abstract

The present invention provides a lead-free glass for semiconductor encapsulation, which can encapsulate semiconductor devices at a low temperature, has an excellent acid durability and hardly precipitates crystals when forming a glass tube, and an encapsulator for semiconductor encapsulation made of the glass. The glass comprises, as a glass composition, from 45 to 58% of SiO₂, from 0 to 6% of Al₂O₃, from 14.5 to 30% of B₂O₃, from 0 to 3% of MgO, from 0 to 3% of CaO, from 4.2 to 14.2% of ZnO, from 5 to 12% of Li₂O, from 0 to 15% of Na₂O, from 0 to 7% of K₂O, from 15 to 30% of Li₂O+Na₂O+K₂O, and from 0.1 to 8% of TiO₂, in terms of % by mol, wherein a ratio of ZnO to Li₂O is in the range from 0.84 to 2.

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First Claim