SUBSTRATE PROCESSING APPARATUS

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United States of America Patent

SERIAL NO

14014323

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus includes a chamber having a reaction space therein, a substrate seating member disposed in the reaction space of the chamber to seat a substrate thereon, an induction heating unit to heat the substrate seating member, and at least one altitude adjusting unit to selectively adjust the altitude of the induction heating unit at the outside of the chamber according to a temperature adjusting region of the substrate seating member. Therefore, it is possible to constantly control a temperature of the substrate seating member by adjusting the distance length between the substrate seating member and the induction heating unit at the outside of the chamber.

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Patent Owner(s)

Patent OwnerAddress
JUSUNG ENGINEERING CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Sun Hong Pyeongtaek-si, KR 7 165
LEE, Dong Kyu Seoul, KR 68 268
LEE, Ho Chul Seongnam-si, KR 18 101
LEE, Ji Hun Busan, KR 58 330
LEE, Seung Ho Yongin-si, KR 168 1023
LEE, Tae Wan Yongin-si, KR 21 44

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