METHOD OF MANUFACTURING AN LED
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United States of America Patent
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Issued Date -
Jan 2, 2014
app pub date -
Jun 10, 2013
filing date -
Jun 28, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of manufacturing an LED according to an embodiment of the present invention includes back-grinding a substrate of an LED wafer including a light emitting element and the substrate, where the back-grinding includes fixing the LED wafer to a table via a double-sided pressure-sensitive adhesive sheet, and then grinding the substrate.
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