CONFORMAL SHIELDING MODULE

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United States of America Patent

APP PUB NO 20140001471A1
SERIAL NO

13538160

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Abstract

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A conformal shielding module comprising a substrate, at least one electronic component mounted on the substrate, and a molding compound covering the electronic component. The molding compound includes a vertical channel extending from a surface of the molding component to the electronic component, and an electrically conductive structure formed inside the vertical channel. The electrically conductive structure is electrically connected to the electronic component and includes a testing contact on the surface of the molding compound for in-circuit test of the electronic component.

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Patent Owner(s)

Patent OwnerAddress
UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO LTDNANTOU COUNTY 54261
UNIVERSAL SCIENTIFIC INDUSTRIAL CO LTDTAIWAN NANTOU COUNTY CHINA NANTOU COUNTY TAIWAN PROVINCE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LI, Kuan-Hsing Taichung City, TW 15 88

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