SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND RELATED METHODS
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United States of America Patent
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app pub date -
Aug 26, 2013
filing date -
Sep 14, 2010
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Abandoned
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Abstract
A semiconductor package includes leads around the periphery of a chip and leads under the chip having connecting segments for increasing I/O capability. A filling material may be used under the chip, which may provide a lead locking function. Various methods of forming the semiconductor package are further provided.
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