WIRING BOARD
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United States of America Patent
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-
N/A
Issued Date -
Jan 2, 2014
app pub date -
Jun 27, 2013
filing date -
Jun 29, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wiring board in which a semiconductor element connection pad formed on a strip-shaped wiring conductor and an electrode of a semiconductor element are firmly connected together, the wiring board having excellent electrical insulation between the semiconductor element connection pads which are adjacent to each other.
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