METHOD FOR PRODUCING MORE PARTICULARLY PROCESSING OR POPULATING, A CIRCUIT BOARD ELEMENT AND CARRIER FOR USE IN SUCH A METHOD
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United States of America Patent
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app pub date -
Mar 26, 2012
filing date -
Mar 29, 2011
priority date (Note) -
Abandoned
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Abstract
In a method for producing a circuit board element, the following steps are provided:
- providing a substantially whole-area carrier having an adhesive surface;arranging and fixing a starting material of the circuit board element to be produced on the adhesive surface of the carrier;producing the circuit board element fixed on the carrier in a position fixed on the carrier; andremoving the produced circuit board element from the carrier.
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