LOW FORMALDEHYDE EMISSION ADHESIVE SYSTEM
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United States of America Patent
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app pub date -
Feb 4, 2013
filing date -
Aug 13, 2008
priority date (Note) -
Abandoned
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Abstract
The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties.
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Cited Art Landscape
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