POLISHING COMPOSITION AND POLISHING METHOD
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United States of America Patent
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Issued Date -
Jan 16, 2014
app pub date -
Mar 28, 2012
filing date -
Mar 30, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed is a polishing composition containing a pH-lowering substance and a pH-buffering agent. The difference in absolute value between the pH of the polishing composition immediately after adding a 31% by weight hydrogen peroxide solution thereto at 5.16 g per 100 g of the polishing composition and the pH of the polishing composition after leaving to stand for eight days therefrom is 0.5 or less. Also disclosed is another polishing composition containing a pH-lowering substance and a pH-controlling agent. In comparison to the amount of a basic substance in the polishing composition immediately after adding a 31% by weight hydrogen peroxide solution thereto at 5.16 g per 100 ml of the polishing composition, the amount of a basic substance in the polishing composition after leaving to stand for eight days therefrom is increased by no less than 0.1 mM.
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