Laser Processing Method and Semiconductor Device

United States of America Patent

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Sep 17, 2013
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Aug 6, 2004

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Abstract

A laser processing method which can reliably form a modified region within an object to be processed along a desirable part in a line to cut is provided.

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Patent Owner	Address
HAMAMATSU PHOTONICS K K	HAMAMATSU-SHI SHIZUOKA 435-8558

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kuno, Koji	Shizuoka, JP	30	1368
Sakamoto, Takeshi	Shizuoka, JP	265	3583
Suzuki, Tatsuya	Shizuoka, JP	543	6229

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Laser Processing Method and Semiconductor Device

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United States of America Patent

14029574

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14029574

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