SEMICONDUCTOR CHIP INCLUDING HEAT RADIATION PORTION AND METHOD OF FABRICATING THE SEMICONDUCTOR CHIP
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United States of America Patent
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Issued Date -
Jan 16, 2014
app pub date -
Mar 15, 2013
filing date -
Jul 12, 2012
priority date (Note) -
Abandoned
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Abstract
A semiconductor chip includes a semiconductor substrate including a first surface and a second surface, an integrated circuit (IC) on the first surface of the semiconductor substrate, and a heat radiation portion on the second surface of the semiconductor substrate. The heat radiation portion includes heat radiation patterns in a direction perpendicular to the second surface, and a heat radiation layer on upper portions of the heat radiation patterns. The heat radiation patterns include a plurality of recesses and a plurality of protrusions and the heat radiation layer includes a metal material and has a flat upper surface.
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