HEAT DISSIPATING OUTPUT NETWORK
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United States of America Patent
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N/A
Issued Date -
Jan 16, 2014
app pub date -
Sep 4, 2012
filing date -
Jul 10, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipating output network (110) is provided. The heat dissipating output network (110) includes one or more impedance elements (204) and one or more capacitors (206), with the one or more impedance elements (204) and the one or more capacitors (206) coupled together in a network configuration, and with the one or more capacitors (206) selected to perform reactance matching and selected to perform a predetermined amount of heat dissipation in the heat dissipating output network (110).
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