HIGH FREQUENCY MODULE HAVING SURFACE ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jan 16, 2014
app pub date -
Jul 13, 2012
filing date -
Jul 13, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A high frequency module having a surface acoustic wave device and a method of manufacturing the same are provided. The high frequency module includes a substrate provided with a top ground pattern at both upper ends and provided with, inside thereof, an inner ground pattern electrically connected to the top ground pattern through a via electrode; at least one SAW device installed on the substrate; a molding layer formed on the substrate to cover the SAW device and provided with a groove at both ends to expose the top ground pattern; and an electromagnetic wave shield layer formed to cover a surface of the molding layer including an inside of the groove.
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