WAFERLESS MEASUREMENT RECIPE
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United States of America Patent
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Issued Date -
Jan 16, 2014
app pub date -
Jul 10, 2012
filing date -
Jul 10, 2012
priority date (Note) -
Abandoned
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Abstract
Embodiments relate to a method for manufacturing and processing semiconductor devices or integrated circuits (IC) and in particular to the generation of measurement recipes in the manufacturing of the semiconductor devices or ICs. The method comprises defining a sampling plan, mapping target locations of a device contained in the sampling plan to an article/a wafer having a plurality of said devices, verifying the mapping file and processing the verification to produce a measurement recipe. In one embodiment, the measurement recipe is created without having the actual processed wafer.
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