DEVICE INCLUDING QUANTUM DOTS

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United States of America Patent

APP PUB NO 20140027713A1
SERIAL NO

14042074

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Abstract

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A method for making a device, the method comprising: depositing a layer comprising quantum dots over a first electrode, the quantum dots including ligands attached to the outer surfaces thereof; treating the surface of the deposited layer comprising quantum dots to remove the exposed ligands; and forming a device layer thereover. Also disclosed is a device made in accordance with the disclosed method. Another aspect of the invention relates to a device comprising a first electrode and a second electrode, and a layer comprising quantum dots between the two electrodes, the layer comprising quantum dots deposited from a dispersion that have been treated to remove exposed ligands after formation of the layer in the device. Another aspect of the invention relates to a device comprising a first electrode and a second electrode, a layer comprising a first inorganic semiconductor material disposed between the first and second electrodes, and a plurality of quantum dots disposed between the first and second electrodes, the outer surface of the quantum dots comprising a second inorganic semiconductor material, wherein the composition of the first inorganic semiconductor material and the second inorganic semiconductor material is the same (without regard to any ligands on the outer surface of the quantum dot).

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG RESEARCH AMERICA INC665 CLYDE AVENUE MOUNTAIN VIEW CA 94043

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Breen, Craig Somerville, US 66 1687
Cox, Marshall Brooklyn, US 27 938
Steckel, Jonathan S Carlisle, US 53 1856
Zhou, Zhaoqun Bedford, US 17 189

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