Low Stress Package For an Integrated Circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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app pub date -
Jul 27, 2013
filing date -
Jul 27, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A package that electrically connects an integrated circuit to a printed circuit board includes a frame and a package body that encases a portion of the frame and the integrated circuit. The frame includes a mounting region that is connected to the printed circuit board, and a cantilevering region that cantilevers away from the mounting region. The cantilevering region retains the integrated circuit in a flexible fashion.
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