METHOD OF FORMING METAL THIN FILM USING ELECTROLESS DEPOSITION AND THIN FILM DEVICE FABRICATED USING THE METHOD
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United States of America Patent
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Issued Date -
Jan 30, 2014
app pub date -
Oct 30, 2012
filing date -
Jul 26, 2012
priority date (Note) -
Abandoned
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Abstract
Provided is a technique for electroless deposition (ELD) for forming metal conductive layer on an insulating substrate made of glass, polymer, etc. According to an aspect, an adhesive layer and a catalyst layer are formed on a substrate using a dry deposition method, such as are plasma deposition (APD) or sputtering, etc., and electroless deposition is performed thereon, thereby forming a metal thin, film. Therefore, it is possible to significantly simplify a complicated pretreatment process required for electroless depositions and increase adhesive strength of a deposited metal thin film.
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