POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
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United States of America Patent
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Jan 30, 2014
app pub date -
Feb 2, 2012
filing date -
Feb 3, 2011
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Abstract
Provided is a polishing composition that does not contain abrasives and that is used for polishing a silicon wafer, the polishing composition including a pH buffer, a polishing accelerator, a water-soluble polymer, and a block-type compound. By polishing a silicon wafer by using the polishing composition, a polishing speed of greater than 0.1 μm/min can be achieved.
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