Semiconductor devices having a diffusion barrier layer and methods of manufacturing the same

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United States of America Patent

PATENT NO 8963227
SERIAL NO

14049570

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Abstract

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Methods of manufacturing a semiconductor device include forming a gate insulation layer including a high-k dielectric material on a substrate that is divided into a first region and a second region; forming a diffusion barrier layer including a first metal on a second portion of the gate insulation layer in the second region; forming a diffusion layer on the gate insulation layer and the diffusion barrier layer; and diffusing an element of the diffusion layer into a first portion of the gate insulation layer in the first region.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Do, Jin-Ho Hwaseong-si, KR 9 43
Joo, Dae-Kwon Osan-si, KR 12 64
Kim, Weon-Hong Suwon-si, KR 64 1137
Lim, Ha-Jin Seoul, KR 37 536
Song, Moon-Kyun Anyang-si, KR 16 99

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