SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE
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United States of America Patent
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Issued Date -
Feb 13, 2014
app pub date -
Aug 7, 2013
filing date -
Aug 13, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed herein is a semiconductor device that includes: a semiconductor substrate including first and second surfaces opposed to each other, a plurality of penetration electrodes each penetrating between the first and second surfaces and a plurality of first metal films each surrounding an associated one of the penetration electrodes with an intervention of an insulating film; and a wiring structure formed on a side of the first surface of the semiconductor substrate, the wiring structure including a plurality of wirings each electrically connected to an associated one of the penetration electrodes.
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