DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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N/A
Issued Date -
Feb 13, 2014
app pub date -
Aug 5, 2013
filing date -
Aug 7, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.
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