MULTI-CAVITY WIRING BOARD FOR SEMICONDUCTOR ASSEMBLY WITH INTERNAL ELECTROMAGNETIC SHIELDING
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United States of America Patent
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app pub date -
Aug 9, 2013
filing date -
Aug 14, 2012
priority date (Note) -
Abandoned
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Abstract
A multi-cavity wiring board includes a coreless substrate, an adhesive, and a stiffener having a plurality of apertures with lateral shielding sidewalls. The coreless substrate covers the stiffener and includes electrical pads exposed from the apertures of the stiffener as electrical contacts for semiconductor devices packaged within the apertures. The aperture sidewalls of the stiffener can serve as effective lateral electromagnetic shields for the semiconductor devices within the apertures.
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