SEMICONDUCTOR ASSEMBLY WITH DUAL CONNECTING CHANNELS BETWEEN INTERPOSER AND CORELESS SUBSTRATE
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United States of America Patent
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Issued Date -
Feb 20, 2014
app pub date -
Jun 14, 2013
filing date -
Aug 14, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor assembly includes a semiconductor device, a through-via interposer, a coreless substrate and a stiffener. The semiconductor device is flip mounted on the interposer, and the interposer is affixed on the coreless substrate by adhesive and extends into an aperture of a stiffener which provides mechanical support for the coreless substrate. The electrically connection between the interposer and the coreless substrate includes bond wire and conductive micro-via. The coreless substrate can provide fan-out routing for the interposer.
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