VACUUM APPARATUS, METHOD FOR COOLING HEAT SOURCE IN VACUUM, AND THIN FILM MANUFACTURING METHOD

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United States of America Patent

APP PUB NO 20140050850A1
SERIAL NO

13985794

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Abstract

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A vacuum apparatus (100) includes: a vacuum chamber (11); a heat source (12) disposed inside the vacuum chamber (11); a cooling device (20) that cools the heat source (12) by circulation of a cooling gas; a gas feed line (1) connected to the cooling device (20) and extending outside the vacuum chamber (11); a cooling gas feeder (14) that feeds the cooling gas to the cooling device (20) through the gas feed line (1) when the heat source (12) is to be cooled; and a vacuum pump (13) that evacuates the cooling device (20) when the heat source (12) is to be used.

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Patent Owner(s)

Patent OwnerAddress
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bessho, Kunihiko Osaka, JP 12 115
Honda, Kazuyoshi Osaka, JP 178 1307
Okazaki, Sadayuki Osaka, JP 42 441
Shimada, Takashi Osaka, JP 179 1235

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