ABRASIVE AND POLISHING COMPOSITION
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United States of America Patent
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Issued Date -
Feb 20, 2014
app pub date -
Jan 19, 2012
filing date -
Jan 27, 2011
priority date (Note) -
Abandoned
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Abstract
Provided is a polishing composition containing an abrasive and water. The abrasive content in the polishing composition is no less than 0.1% by mass. The abrasive contains zirconium oxide particles. The zirconium oxide particles have a specific surface area of from 1 to 15 m2/g. The zirconium oxide particles preferably have a purity of no less than 99% by mass. The polishing composition is used in, for example, polishing a hard and brittle material, such as sapphire, silicon nitride, silicon carbide, silicon oxide, glass, gallium nitride, gallium arsenide, indium arsenide, and indium phosphide.
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