MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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N/A
Issued Date -
Feb 27, 2014
app pub date -
Aug 2, 2013
filing date -
Aug 22, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for manufacturing a multilayer FPCB includes certain steps. A first printed circuit substrate is provided, the first printed circuit substrate includes a first copper layer and a first protective film, the film defining a first opening. A second printed circuit substrate is provided, this substrate includes a second copper layer and a second protective film. The second protective film defines a second opening. The first printed circuit substrate is laminated together with the second printed circuit substrate by an adhesive sheet. The adhesive sheet defines a third opening in communication with and aligned with the first opening and the second opening. The first copper layer is then etched to form a first outer wiring layer and the third copper layer is also etched to form a second outer wiring layer, thereby obtaining a multilayer FPCB.
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