Co-support system and microelectronic assembly
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United States of America Patent
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-
Jul 22, 2014
Grant Date -
Feb 27, 2014
app pub date -
Mar 15, 2013
filing date -
Aug 27, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A system includes a microelectronic assembly having terminals and a microelectronic element, and a component for connection with the microelectronic assembly. The component includes a support structure bearing conductors configured to carry command and address information, and contacts coupled to the conductors and connected with the terminals of the microelectronic assembly. The contacts have address and command information assignments arranged in a first predetermined arrangement for connection with a first type of microelectronic assembly in which the microelectronic element is configured to sample command and address information coupled thereto through the contacts at a first sampling rate, and in a second predetermined arrangement for connection with a second type of microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the contacts at a second sampling rate greater than the first sampling rate.
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