COPPER FOIL FOR PRINTED CIRCUIT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 27, 2014
app pub date -
Feb 10, 2012
filing date -
Mar 30, 2011
priority date (Note) -
Abandoned
status (Latency Note)
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
Next PAIR Update Scheduled on [ ] |
Importance
US Family Size
|
Non-US Coverage
|
Abstract
Provided is a copper foil with surface treated layers, wherein a copper foil or a copper alloy foil includes a plurality of surface treated layers configured from a roughened layer formed on the copper foil or the copper alloy foil by roughening treatment, a heat-resistant layer made from a Ni—Co layer formed on the roughened layer, and a weathering layer and a rust-preventive layer which contain Zn, Ni, and Cr and is formed on the heat-resistant layer, and the surface treated layers having a (total Zn)/[(total Zn)+(total Ni)] ratio of 0.13 or more and 0.23 or less. In a copper foil clad laminate which uses a copper foil for a printed circuit obtained by performing roughening treatment on a surface of a copper foil and then forming a heat-resistant layer and a rust-preventive layer thereon, and to which silane coupling treatment is subsequently performed, the copper foil for a printed circuit can further inhibit the deterioration in adhesion caused by the acid infiltration into the interface of the copper foil circuit and the substrate resin upon performing acid treatment or chemical etching to the substrate after forming a fine-pattern printed circuit. Thus, the copper foil for printed circuit has superior acid-resistant adhesive strength and superior alkali etchability.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
JX NIPPON MINING & METALS CORPORATION | TOKYO 100-8164 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Arai, Hideta | Ibaraki, JP | 25 | 193 |
Miki, Atsushi | Ibaraki, JP | 76 | 1318 |
Cited Art Landscape
- No Cited Art to Display
Patent Citation Ranking
Forward Cite Landscape
- No Forward Cites to Display
Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 27, 2025 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
Legal Events
Matter Detail
Update Public Data Dismiss Edit SaveRenewals Detail
Edit SaveNote
The template below is formatted to ensure compatibility with our system.
Provide tags with | separated like (tags1|tags2).
Maximum length is 128 characters for Customer Application No
Mandatory Fields * - 'MatterType','AppType','Country','Title','SerialNo'.
Acceptable Date Format - 'MM/DD/YYYY'.
Acceptable Filing/App Types -
- Continuation/Divisional
- Original
- Paris Convention
- PCT National
- With Priority
- EP Validation
- Provisional Conversion
- Reissue
- Provisional
- Foreign Extension
Acceptable Status -
- Pending
- Abandoned
- Unfiled
- Expired
- Granted
Acceptable Matter Types -
- Patent
- Utility Model
- Supplemental Protection Certificate
- Design
- Inventor Certificate
- Plant
- Statutory Invention Reg
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Success
E-mail has been sent successfully.
Failure
Some error occured while sending email. Please check e-mail and try again!
PAIR load has been initiated
A preliminary load of cached data will be loaded soon. Current PAIR data will be loaded within twenty four hours.
File History PDF
Thank you for your purchase! The File Wrapper for Patent Number 20140057123 will be available within the next 24 hours.
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully
Important Notes on Latency of Status data
Please note there is up to 60 days of latency in this Status indicator for certain status conditions. You can obtain up-to-date Status indicator readings by ordering PAIR for the file.
An application with the status "Published" (which means it is pending) may be recently abandoned, but not yet updated to reflect its abandoned status. However, an application filed less than one year ago is unlikely to be abandoned.
A patent with the status "Granted" may be recently expired, but not yet updated to reflect its expired status. However, it is highly unlikely a patent less than 3.5 years old would be expired.
An application with the status "Abandoned" is almost always current, but there is a small chance it was recently revived and the status not yet updated.
Important Note on Priority Date data
This priority date is an estimated earliest priority date and is purely an estimation. This date should not be taken as legal conclusion. No representations are made as to the accuracy of the date listed. Please consult a legal professional before relying on this date.
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.