SUBSTRATE TREATING METHOD

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United States of America Patent

APP PUB NO 20140060575A1
SERIAL NO

14012523

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a substrate treating method. The substrate treating method may include treating a substrate by using a chemical solution; rinsing the substrate by using pure water after treating the substrate by using the chemical solution; and treating the substrate by using an organic solvent, wherein the substrate treating method further includes coating the substrate with a hydrophobic membrane between the treating of the chemical solution and the treating of the organic solvent.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Bok Kyu Chungcheongnam-do, KR 17 18
Lee, Jae Myoung Chungcheongnam-do, KR 37 356
Lee, Jin Bok Chungcheongnam-do, KR 10 26
Lee, Kang Suk Chungcheongnam-do, KR 9 10
Lee, Yong Hee Chungcheongbuk-do, KR 178 665

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