APPARATUS FOR TREATING SUBSTRATE
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United States of America Patent
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Issued Date -
Mar 6, 2014
app pub date -
Aug 28, 2013
filing date -
Aug 31, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a substrate treating apparatus using plasma. A substrate treating apparatus includes a chamber having a treating space therein, a support member disposed in the chamber to support the substrate, a gas supply unit supplying a gas into the chamber, and a plasma source disposed on an upper portion of the camber, the plasma source including an antenna generating plasma from the gas supplied into the chamber, wherein the chamber includes a housing having an opened top surface, the housing having a treating space therein, and a dielectric substance assembly covering the opened top surface of the housing, and wherein the dielectric substance assembly includes a dielectric substance window and a reinforcement film having strength greater than that of the dielectric substance window.
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