LIGHT EMITTING DEVICE USING GAN LED CHIP

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United States of America Patent

SERIAL NO

13888751

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Abstract

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A light emitting device is constituted by flip-chip mounting a GaN-based LED chip. The GaN-based LED chip includes a light-transmissive substrate and a GaN-based semiconductor layer formed on the light-transmissive substrate, wherein the GaN-based semiconductor layer has a laminate structure containing an n-type layer, a light emitting layer and a p-type layer in this order from the light-transmissive substrate side, wherein a positive electrode is formed on the p-type layer, the electrode containing a light-transmissive electrode of an oxide semiconductor and a positive contact electrode electrically connected to the light-transmissive electrode, and the area of the positive contact electrode is half or less of the area of the upper surface of the p-type layer.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI CHEMICAL CORPORATIONCHIYODA-KU TOKYO 100-8251

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRAOKA, Shin Amagasaki-shi, JP 14 237
JOICHI, Takahide Amagasaki-shi, JP 8 82
OKAGAWA, HIROAKI Amagasaki-shi, JP 32 908
SHIMA, Toshihiko Amagasaki-shi, JP 29 210
TANIGUCHI, Hirokazu Amagasaki-shi, JP 64 445

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