PACKAGE ON PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Mar 6, 2014
app pub date -
Feb 1, 2013
filing date -
Aug 31, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for manufacturing a package on package structure includes the step of: providing a package body comprising a first package device and a connection substrate, the first package device comprising a number of first solder pads, the connection substrate comprising a substrate main body and a number of first electrically conductive posts, the first electrically conductive posts spatially corresponding to and being connected to the first solder pads, and a solder paste printed on each first electrically conductive post; attaching a second device on the second surface of the connection substrate, thereby obtaining a stacked structure, the second package device comprising a number of second solder pads; and solidifying the solder paste on each first electrically conductive post, such that each second solder pad is soldered to the corresponding first electrically conductive post using the solder paste, thereby obtaining a package on package structure.
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